Chiplet Interconnect IP
GlasswingTM
From enabling deep learning workloads to accelerating time to market, make every IP interface better. Designed to utilize CNRZ-5 Chord™ Signaling, the Glasswing chip-to-chip link IP solution gives you more bits with lower power and fewer pins, without sacrificing margins.
Why Glasswing™
Do more with Chord™ signaling
The only USR SerDes IP proven in low-cost silicon, and capable of providing 1Tbps bandwidth at under one watt, Glasswing offers the power savings and reliability essential for networking, high-performance computing, AI and ML. So from online shopping to satellite communications, you can do so much more
Massive bandwidth
Glasswing can be tiled in both directions to deliver terabits of bandwidth between dies. At 25GB/s, Glasswing offers double the bandwidth of the current UCIe standard, at a fraction of the size
Supports large MCMs
Glasswing can tolerate exceptionally high levels of loss whilst maintaining signal integrity. So you can work with the largest MCMs efficiently, using corner turning and extended reach to expand your designs and integrate a far more complex collection of dies
Outstanding diagnostics
Glasswing’s built-in EyeScope shows you signal strength in real time. So you can debug and test links quickly and easily, with full confidence in the end signal quality
Complete feature list
500 Gbits/s of bidirectional throughput
1.04 pJ/bit or 1 Tbit/s per Watt
Beachfront bandwidth: 208 Gbit/s/mm die edge
6 dB insertion loss budget (40+ mm on GZ-41 substrate)
Standard 150 µm bump pitch, so no interposer required
Low, fixed latency
Native BER of 1E-15
Optional Forward Error Correction (FEC) can be implemented to improve BER well below 1E-20
PRBS pattern generators and loopback modes
Protocol agnostic
Built-in EyeScope and advanced diagnostics
Built in versatality
Divide your chip more flexibly
Assemble multiple dies or chiplets in the best configuration for your design
No interposer
Because Glasswing works with a substrate, you can save money by avoiding awkward silicon interposers
Scale down
Reduce the size of your largest die in order to enhance its yield or address reticle size limits
Existing ecosystem
You’re not on your own with Glasswing. There’s already a whole ecosystem of existing users to learn from and share insights
Glasswing™ - Ultra-Short Reach SerDes IP
High-density, low-power SerDes IP delivering 500 Gbit/s throughput for in-package and multi-chip module interconnects, without a silicon interposer.
GW12-500-usr
Powered by Copper MIMO
(Chord SignalingTM)