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Feb 12, 2020
Kandou's CEO to Address Future Signaling Solutions at ISSCC
Jan 29, 2020
Kandou to Demonstrate USR SerDes IP, USB4 Retimer at DesignCon 2020
Dec 12, 2019
Kandou Demonstrates Prototype of First USB4 Multiprotocol Retimer at CES
Sep 10, 2019
Kandou Announces Development of USB4™ Retimer
Aug 7, 2019
Kandou Completes Series C Fundraising
Apr 19, 2019
An Important Milestone
Dec 11, 2018
Kandou's 100th Patent
Oct 8, 2018
A New White Paper on Kandou's Glasswing IP
Jul 24, 2018
Kandou Bus Closes Series B Investment Round
Jun 25, 2018
Kandou's Dr. Amin Shokrollahi to Speak about Chord™ Signaling at Design Automation Conference (DAC)
Jun 2, 2018
Glasswing IP and Moore's Law
Jan 25, 2018
Kandou to Demonstrate 500 Gbit/s USR Glasswing PHY at DesignCon 2018
Aug 10, 2017
Kandou Glasswing Silicon Back from Foundry
Sep 20, 2016
Kandou was elected among the top 60 emerging companies to watch by EE Times
Jul 25, 2016
Bessemer Venture Partners Invests $15 Million in Kandou
Jul 11, 2016
Kandou's Glasswing IP JEDEC Compliant
Mar 28, 2016
Kandou Licenses Glasswing SerDes Technology to Marvell
Mar 14, 2016
Kandou's David Stauffer to Speak about ENRZ at OFC Market Watch Session
Mar 16, 2014
The next generation's modulation - PAM-4, NRZ, or ENRZ?
Mar 4, 2014
Kandou Touts Multi-Signal Chords
Feb 25, 2014
OIF Product Showcase at OFC Features Cutting-Edge Products Utilizing OIF Supported Technology
Feb 23, 2014
A brief history of Kandou Bus
Feb 18, 2014
Startup Promises Bandwidth Boost
Feb 10, 2014
Kandou Resolves Today's Chip Interconnect Performance/Power Bottleneck for Mobile and Networking Applications
Aug 29, 2013
More power for mobiles & Co., Success Startup
Aug 19, 2026
Cracking the Memory Maze : Copper, Optics, and the Future of AI Data Movement
Aug 14, 2026
Kandou AI Wins “Demo of the Year” Award at TSMC 2026 Europe Technology Symposium
Jul 14, 2026
Kandou AI Selects Baya Systems to Power Its Attack on the AI Memory Wall
Jul 10, 2026
Kandou AI to Open India Chip Design Headquarters in Hyderabad
Jun 3, 2026
Kandou AI Demonstrates Revolutionary 260 Gbps Tigerwing™ Chip-to-Chip Interface in Silicon at 2026 TSMC Europe Technology Symposium
Mar 23, 2026
Kandou AI Secures Strategic Funding to Redefine AI Connectivity and Break Memory Bottlenecks in AI
Dec 16, 2025
Kandou AI Appoints Taher Madraswala as Chief Operating Officer
Sep 22, 2025
Lower-Power Datacenter Design: Unlocking AI’s sustainability leverage
Sep 2, 2025
Delivering Breakthrough Chip-to-Chip Connectivity with Tigerwing™
Jul 25, 2025
Kandou AI Completes Innosuisse-Funded Project
Jun 10, 2025
Kandou AI Unveils Dual-Mode SerDes with 50% Speed Boost
Apr 8, 2025
Kandou AI Appoints Srujan Linga as CEO and Amin Shokrollahi as CTO
Aug 10, 2017
Kandou Glasswing Silicon Back from Foundry
Sep 20, 2016
Kandou was elected among the top 60 emerging companies to watch by EE Times
Jul 25, 2016
Bessemer Venture Partners Invests $15 Million in Kandou
Jul 11, 2016
Kandou's Glasswing IP JEDEC Compliant
Mar 28, 2016
Kandou Licenses Glasswing SerDes Technology to Marvell
Mar 14, 2016
Kandou's David Stauffer to Speak about ENRZ at OFC Market Watch Session
Mar 16, 2014
The next generation's modulation - PAM-4, NRZ, or ENRZ?
Mar 4, 2014
Kandou Touts Multi-Signal Chords
Feb 25, 2014
OIF Product Showcase at OFC Features Cutting-Edge Products Utilizing OIF Supported Technology
Feb 23, 2014
A brief history of Kandou Bus
Feb 18, 2014
Startup Promises Bandwidth Boost
Feb 10, 2014
Kandou Resolves Today's Chip Interconnect Performance/Power Bottleneck for Mobile and Networking Applications
Aug 29, 2013
More power for mobiles & Co., Success Startup
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