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Oct 3, 2023
Kandou Appoints Marvell’s Raj Singh to its Board of Directors
Sep 26, 2023
Kandou will be presenting Its Vision, Market-Leading Solutions Strategy at JP Morgan Tech Stars Conference
Sep 18, 2023
History of the Chiplet – And Why it is the Future
Sep 13, 2023
A New Chapter for Kandou: Closing the First Round of $100M Equity Financing
Aug 25, 2023
Kandou Unveils PCIe® Retimer Solution for Data Center Applications
Apr 11, 2023
Kandou Appoints Thomas Boudrot as Vice President of Sales and Business Development
Apr 5, 2023
5 Reasons Why USB4® Is a No Brainer
Feb 21, 2023
Kandou’s Vision, Market-Leading Solutions Strategy to be Presented at Morgan Stanley Technology, Media & Telecom Conference
Jan 24, 2023
Kandou Receives ISO 9001 Certification
Jan 18, 2023
Kandou to Demonstrate Glasswing SerDes at Chiplet Summit
Jan 9, 2023
Kandou’s CEO Dr. Amin Shokrollahi and CFO Jeff Winzeler to Present at the Needham’s 25th Annual Growth Conference 2023
Dec 9, 2022
Kandou Demonstrates Full Line of USB4® Multiprotocol Retimers at CES
Aug 10, 2017
Kandou Glasswing Silicon Back from Foundry
Sep 20, 2016
Kandou was elected among the top 60 emerging companies to watch by EE Times
Jul 25, 2016
Bessemer Venture Partners Invests $15 Million in Kandou
Jul 11, 2016
Kandou's Glasswing IP JEDEC Compliant
Mar 28, 2016
Kandou Licenses Glasswing SerDes Technology to Marvell
Mar 14, 2016
Kandou's David Stauffer to Speak about ENRZ at OFC Market Watch Session
Mar 16, 2014
The next generation's modulation - PAM-4, NRZ, or ENRZ?
Mar 4, 2014
Kandou Touts Multi-Signal Chords
Feb 25, 2014
OIF Product Showcase at OFC Features Cutting-Edge Products Utilizing OIF Supported Technology
Feb 23, 2014
A brief history of Kandou Bus
Feb 18, 2014
Startup Promises Bandwidth Boost
Feb 10, 2014
Kandou Resolves Today's Chip Interconnect Performance/Power Bottleneck for Mobile and Networking Applications
Aug 29, 2013
More power for mobiles & Co., Success Startup
May 27, 2021
Kandou Unveils First Device in USB-C® Multiprotocol Retimer Product Family for USB4
Mar 25, 2021
Waiting for Chiplet Standards
Mar 24, 2021
Chiplets Gain Popularity, Integration Challenges
Mar 15, 2021
Designing 2.5D Systems
Jan 28, 2021
Retiming USB4 over USB-C®
Nov 17, 2020
Kandou Raises $92.3 million in Series C Funding
Oct 21, 2020
Matterhorn is a Game Changer!
Jul 16, 2020
Kandou Appoints Jeff Winzeler CFO
Jul 9, 2020
Say Hello to Matterhorn
May 12, 2020
Coherent Logix Selects Kandou’s SerDes IP
Apr 15, 2020
Kandou Named One of Europe's Most-Promising Growth Companies
Feb 20, 2020
Three EPFL spin-offs among Europe's top 50 "super scale-ups"
Aug 10, 2017
Kandou Glasswing Silicon Back from Foundry
Sep 20, 2016
Kandou was elected among the top 60 emerging companies to watch by EE Times
Jul 25, 2016
Bessemer Venture Partners Invests $15 Million in Kandou
Jul 11, 2016
Kandou's Glasswing IP JEDEC Compliant
Mar 28, 2016
Kandou Licenses Glasswing SerDes Technology to Marvell
Mar 14, 2016
Kandou's David Stauffer to Speak about ENRZ at OFC Market Watch Session
Mar 16, 2014
The next generation's modulation - PAM-4, NRZ, or ENRZ?
Mar 4, 2014
Kandou Touts Multi-Signal Chords
Feb 25, 2014
OIF Product Showcase at OFC Features Cutting-Edge Products Utilizing OIF Supported Technology
Feb 23, 2014
A brief history of Kandou Bus
Feb 18, 2014
Startup Promises Bandwidth Boost
Feb 10, 2014
Kandou Resolves Today's Chip Interconnect Performance/Power Bottleneck for Mobile and Networking Applications
Aug 29, 2013
More power for mobiles & Co., Success Startup
