AI is driving deep structural change everywhere from enterprise data centers to edge endpoints, but this growth comes with a heavy tag: water and energy consumption. As chip designers, system architects, and hyperscale operators push the limits of compute, the underlying physical infrastructure is running into hard constraints, especially around…
At the end of August 2025, we announced a breakthrough in chip connectivity: the successful tape-out of Tigerwing™, our next-generation chip-to-chip interconnect IP, on TSMC’s leading-edge process node. In just four months from concept to tape-out, our team achieved a milestone that sets new benchmarks for innovation, performance, and speed…
KandouAI is proud to announce the successful completion of our innovation project, a milestone made possible through the support of the prestigious Innosuisse Swiss Accelerator program. Being selected as one of the very few recipients from over 750 applicants across Switzerland is a testament to our team’s capabilities, vision, and…
At the 2025 IEEE Custom Integrated Circuits Conference (CICC) in Boston, Kandou AI introduced a breakthrough in high-speed data transmission: a dual-mode long-reach SerDes transceiver supporting both NRZ (Non-Return to Zero) and ENRZ (Ensemble NRZ) signaling schemes. This new SerDes architecture sets a new benchmark in energy-efficient, high-performance data communication…